New product NEW 〉 〉 〉 STMicroelectronics (ST) Leading 900V MOSFET Transistors Improve the output power and energy efficiency of the flyback converter China, March 23, 2017 - ST's new 900VMDmeshTM K5 super-junction MOSFET allows power supply designers to meet higher power and more energy efficient system requirements with the best on-resistance (RDS) in their class (ON)) and dynamic characteristics. The 900V breakdown voltage ensures a high safety factor for high bus voltage systems. The new series includes the first 900V MOSFET with RDS(ON) on-resistance less than 100m?, which is the lowest DPAK product with the lowest RDS(ON) resistance. The industry's lowest gate charge (Qg) ensures faster switching speeds and greater configuration flexibility in applications that require a wide input voltage. These features ensure that various flyback converters, such as standard quasi-resonant circuits and active clamp designs, are energy efficient and reliable, covering power ratings down to 35W up to 230W. In addition, low input and output capacitors (Ciss, Coss) enable zero voltage switching, minimizing power loss in half-bridge LLC resonant converters. The new device's high safety factor and excellent dynamics allow designers to improve the performance of a variety of products, such as server power, three-phase switching power supply (SMPS), LED lighting power, electric vehicle (EV) chargers, solar panels, Welding machines, industrial equipment drive systems and factory automation. STMicroelectronics' MDmesh K5 series of superjunction transistors are available in a wide range of products including 800V, 850V, 900V, 950V, 1050V, 1200V and 1500V rated voltages. Coupled with flexible package options, including TO-220AB, TO-220FP, TO-247, TO-247 long pins, IPAK and I2PAK, as well as D2PAK and DPAK surface power packages, STMicroelectronics offers designers a rich set of super Junction ultra high voltage (VHV) MOSFET products. The latest 900V MDmeshTM K5 MOSFET is available today in the DPAK package STD4N90K5. For more details, please visit Thank you for your interest in this content.
Future Bus connectors Description
Antenk future bus connecto feature
designed in metric dirnension on 2 millimeters grid over 5 rows.
1 Standardized product through EIA (USA), IEC and CECC (international).
12 differents mating lengths on signal and 3 on power for standard connector system.
Future Bus connectors Application
Antenk offers a complete line of 5+2 and 8+2 Hard Metric Connectors as well as a complete line of 4 and 5 row Future bus Connectors.
Vertical, 5 Rows
2mm HM (hardmetric) Connector Introduction
System designed to meet the current and future needs of instrumentation applications giving excellent electrical and mechanical characteristics. It is a high performance, high density system with flexible configuration which offers upgradeability. The connector system is fully supported by Antenk spice models to guarantee choosing the right product to match the application.
ANTENK 2.0mm HARD METRIC CONNECTOR MODULES comply with international IEC 917and IEC 61076-4-101 Metric Connectors,2.0Mm Hard Metric Connectors,Hard Metric Connectors,Hard Metric Female Connector,2.0mm Future Bus Connector Male DIP,2.0mm Future Bus Connector Female DIP ShenZhen Antenk Electronics Co,Ltd , https://www.atkconnectors.com
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Future Bus connectors, which use 2mm style have a mating distance of 10mm. Both Future bus and the upgrade Future bus+ are out-dated.No additional work has been done to upgrade the specification over the years. However we still produce products which meet the Physical and Electrical layers of IEE P896.
2 Selected by IEEE as the interconnection system for Futurebus + / SCI / VicBus.
3 Multi-sources product,use for telecommunication, network, server / workstation market.
4 High tempersture materials SMT compatible.
5 Modular design giving flexibility for system design.
6 Stackable end to end without loss of contact position.
7 High density (more than 2 times as compared to the standard inch based " Euroconnector DIN 41612" ).
8 Tuning Fork female contact concept for higher robustness and improved reliability
(low contact resistance and high normal force).
9 Low insertion force design.
10 Inverse connector system (signal and power).
11 Optimized solder and compliant press-fit terminations for backplane and circuit board connectors.
Telecom backplane board
4 and 5 row Future bus Connectors
4 Rows Signal & Power
5 Rows Signal & Power
Female IDC Type 4&5 Rows
Power Connector & Cable
Shroud
Right Aangle, 5 Rows
Vertical, 4 Rows
Right Angle, 4 Rows
5+2 and 8+2 Hard Metric Connectors
2.0mm Future Bus Connector Male DIP
2.0mm Future Bus Connector Female DIP
2.0mm Future Bus Connector Male Press Fit
2.0mm Future Bus Connector Female Press Fit
2.0mm Future Bus Connector Power Type
standards. The connector systems in telecommunication and other industries require hight density connectors to support
larger amounts of data increasingly higher speeds antenk 2mm hardmetric modules offer the solution
Features and Benefits:
This high density connector modules can be stacked end to end without loss of space.
1,ANTENK developed the 2.0mm series under thorough consideration of impedance match, propagation delay,
cross talk, reflection. It is the ideal connector for digital high speed data application.
2,ANTENK offers differend types with inverted mating configuration. The male connector is a fixed module at the
backplane and the female commector is a free component of the plug-in module. The male connector has 5 signal row.
3 The outer shielding rows z and f of the male connector engage the shielding contacts of the famale connector. theshield
is also designed for gas tight, press-fit installation.
4 The connector system offers 15 contact length that utilize the proven press-fit assembly technique. Within the 15
contact length are 3 mating levels, achievable on both the plug-in and rear I / 0 side.
5 Coding system prevents mix-up and wrong mating between male and female connectors.
6 The 2.0mm hard metric connectors and DIN 41612 connectors can be used on the same PC board as both have the
same mating distance.
7 Staggered make-break pin populations for optional hot-swap capability.
8 Rear pin option for through-the-backplane I/O application.
9 High density PCI capability,shield for EMI/RFI protection.
2mm HM (hardmetric) Connector Features:
High density system with small real estate on backplane and daughtercard
Extensive range of signal, power, coaxial and fibre board-to-board and cable-to-board connections
Modular units give flexible configuration
Special versions for VME64 extensions and CompactPCI
Signal contact rating 1.5a fully energized
Universal power module rated at 7.8A/line, 23.4A fully energized
All lines impedance controlled to 50 (single ended) and 100Ω (differential) nominal
Safe design, complies with IEC950 in mated condition
Universal power module is safe in unmated condition
Several performance levels for board and cable connectors with unshielded and shielded versions
Mismatching keys block mating before any contact touch
Small press fit board hole allows maximum track width and minimum signal corruption
1.4 to 5.6mm (0.055 to 0.220 inch) Backplane thickness range
2mm HM (hardmetric) Connector Applications
Communications & Networking, Computers & Computer Peripherals, Sensing & Instrumentation