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Which semiconductor processes, market segments, and laser types will drive the growth of the laser device market?
**Laser Technologies in Semiconductor Manufacturing**
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**Which semiconductor processes, market segments, and laser types will drive the growth of the laser equipment market?**
Since its invention in 1958, laser technology has found widespread use across research, military, medical, and commercial fields. Recently, the laser industry has discovered new opportunities in semiconductor manufacturing, opening up new platforms for advanced applications. Today, lasers are used in a wide range of semiconductor processes, including cutting, vias, soldering, stripping, marking, patterning, measuring, and deposition. These technologies are now essential in processing semiconductor devices, high-density interconnect (HDI) printed circuit boards (PCBs), and integrated circuit (IC) packaging.
The drivers behind the growth of laser applications vary by process, but there are common factors that promote their adoption. These include:
- The demand for smaller chips and more compact electronic devices like smartphones, tablets, wearables, and consumer electronics.
- Increased need for higher production efficiency and yield.
- Improved chip quality and reliability.
- The necessity to detect voids and particulates through transparent materials such as glass.
- Laser annealing to enhance the performance of advanced devices.
The choice of laser type depends on the material being processed, the required parameters, and the overall manufacturing process. This report offers an in-depth analysis of current laser solutions for various semiconductor applications, along with the maturity and development roadmap of each technology.
Laser technology is widely used in semiconductor manufacturing, from front-end to back-end processes. A variety of laser types are available, defined by parameters such as wavelength (e.g., ultraviolet, green, or infrared) and pulse duration (nanosecond, picosecond, or femtosecond). The selection of the right laser is crucial for optimizing performance and cost.
According to Yole, the laser equipment market is expected to exceed $4 billion by 2022, growing at a compound annual rate of 15% from 2016 to 2022. Key drivers include cutting, vias, and patterning in flexible PCBs, IC substrates, and semiconductor device processing. Nanosecond lasers dominate the market, accounting for over 60% of the share, followed by picosecond, CO2, and femtosecond lasers.
In cutting applications, the choice of laser depends on the material. For low dielectric constant materials, UV nanosecond and picosecond lasers are preferred. Infrared picosecond and femtosecond lasers are commonly used for glass and sapphire, but not for SiC. In via creation, the choice varies by substrate—UV nanosecond lasers are used for flexible PCBs, while CO2 lasers are more common for HDI PCBs and IC substrates. When via diameters are less than 20 microns, picosecond UV lasers are often chosen for better quality, despite higher costs.
CO2 lasers remain the most economical and efficient option for high-power applications where thermal damage is not a concern. While nanosecond lasers are currently dominant, picosecond and femtosecond lasers are expected to gain traction. However, femtosecond lasers are more complex and costly.
This report provides detailed insights into the laser equipment and sources used in semiconductor manufacturing, along with future trends, technological developments, and market forecasts. It also breaks down the growth, demand, and market size of the laser equipment market by laser type and application from 2016 to 2022.
The laser equipment market in the semiconductor industry is highly competitive, with numerous suppliers offering diverse solutions across different materials and processes. Although concentrated in Germany, Asia, and the U.S., the market is becoming more fragmented as new players enter with cost-effective options. Companies like Han’s Laser and Delphi Laser have captured significant market shares in China, supported by local government initiatives.
Mergers and acquisitions between laser source manufacturers and equipment suppliers, such as ESI and EOLITE, or Rofin and Coherent, are shaping the supply chain. These partnerships help companies capture value from both the laser source and equipment markets.
Major players in the laser equipment sector include Accretech, Amplitude Systems, Applied Materials, Coherent/Rofin, 3D Micromac, Delphi Laser, Disco, Electro Scientific Industries (ESI), IPG Photonics, Lumentum, LPKF, and many others. This report maps out the key manufacturers and their capabilities, providing a comprehensive view of the competitive landscape.
With continuous innovation and evolving demands, the laser equipment market in semiconductor manufacturing is set for sustained growth, driven by precision, efficiency, and cost-effectiveness.