Infineon's two nirvana - Dresden fab and 48 volt car battery

Recently talked with a number of automotive electronics chip companies, such as Infineon, Freescale, ST or NXP. They have a common goal, to win Renesas, and to get a major design order (Design-wins) from Japanese automakers such as Toyota.

Non-Japanese auto chip makers work closely with OEMs relying on Japan, which was previously impossible, but it will soon become a reality. Because Renesas, the world's largest supplier of automotive chips, has begun to lose control in recent years.

Infineon is no exception. At the press conference on September 24th, Jochen Hanebeck, president of Infineon Automotive Electronics, told reporters that the German chip company ranked sixth in the Japanese automotive electronics market in 2010 and has been in 2013. Rise to third.

Dresden's power semiconductor

Infineon focuses on powertrain, safety and body control, and has a broad product line in automotive electronics. Includes power devices, MCUs, and sensors. All in all, the German core company continues to expand its presence in the global automotive electronics market with its expertise in power semiconductors and MCUs. Infineon’s secret weapon is its Fab in Dresden, which has the highest-automatic 200mm fab and its “home-grown” 300mm “thin” wafer for Production of power semiconductors.

Infineon's Dresden plant provides the first production wafer fab in the industry.

Hanebeck said that the original use of these Dresden 300mm thin wafers was to produce power semiconductors for home electronics. However, in recent years, these lines have begun to manufacture power semiconductors for automotive electronics applications.

When asked about the company's plan for SiC power semiconductors, Infineon said that SiC developed for hybrid cars and other electric-engined cars was carried out in Villach, Austria. The company has not yet planned to manufacture SiC in Dresden.

48V system to meet CO2 emissions targets

Obviously, semiconductor companies are "responsible" to meet CO2 emissions targets in the future, Hanebeck said. Applications such as dual clutch technology, tire pressure and automatic start-stop technology have increased the use of semiconductor devices in automobiles. These semiconductors, in turn, have helped reduce the carbon dioxide emissions of internal combustion engines to a certain extent.

Hanebeck explained that if innovative technology is used, small cars (with a fuel engine) can achieve 90 grams of CO2 emissions per kilometer by 2020, which is below the European emissions target of 95 g/km.

He also pointed out that the bad news is that it is impossible to meet the European 2020 CO3 emission target by 2020, whether it is medium emissions or a luxury car with a gasoline engine.

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